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Common classification of ceramic shell
2021-08-21
Ceramic tube shell is mainly used in the production of power electronics industry, such as as the outer shell of high-frequency and high-power electronic tubes, electric vacuum tube switches, etc. Glass was the earliest material used as the shell of electron tubes, but due to the large dielectric loss of the material itself, and the rapid heating, it is easy to cause problems such as bursting of the shell. At present, the shells used in high-power electronics are all alumina (Al203) ceramics. Alumina ceramics have the advantages of high mechanical strength, good insulation performance, low high-frequency loss, high electrical strength, high temperature resistance, thermal shock resistance, etc., and have the advantages that glass can’t match. It is the most suitable tube for high-power electronic tubes on the market. Shell.
Some common ceramic shells:
1. Gold-tin cover dual-in-line package (SBDIP)
The gold tin cover package package is also called dual in-line package or DIP or DIL. The through-hole package consists of a sintered ceramic substrate, and two parallel rows of copper-plated pins are distributed on the edge of the substrate. Gold-tin cover dual-in-line packaging has large applications in semiconductor technology such as logic circuits, memory cards, microcontrollers and video controllers and consumer electronics, electronic commerce, military electronics, automobiles and communications, and has easy Installation, welding, separation, good heat dissipation performance, and the pins have been gold-plated in advance.
2. Ceramic Quad Flat Package (CQFP)
The ceramic four-sided lead flat package adopts a sealed surface mount package form. The ceramic and the lead frame are sealed together through glass to complete the connection between the internal chips and the external circuit board. The ceramic four-sided pin flat package is widely used in digital-to-analog converters, microwaves, logic circuit memory, microcontrollers and video controllers, etc. It has a variety of pin forms and pin coatings, and the pressure welding feet are coated with gold or aluminum. , The structure is mostly E-shaped or J-shaped, and the packaging materials are diverse.
3. Ceramic pin grid matrix package (CPGA)
The ceramic pin grid matrix package has the advantages of small size, excellent electrical characteristics, low electrical inductance, and good heat dissipation. Its through-hole package is composed of a sintered ceramic base with a gold-plated pin matrix on the bottom or top of the base. The sealing material of the package cover can be ceramic glass or metal welding. The ceramic pin grid matrix package has the characteristics of solid structure, various package sizes, multi-layer ceramic package, cavity facing upwards or cavity facing downwards.
4. TO Headers
The TO packaged case is mainly used in highly reliable microcircuit modules. The single-structure TO packaged case has high strength and can withstand high pressure. The TO packaged case can meet a variety of needs. TO metal shell has the characteristics of simplified circuit installation, convenient inspection and testing, high reliability, and various sizes and pin numbers.
5. Small outline integrated circuit packaging (SOIC)
The small-profile integrated circuit package has various specifications, which can meet some requirements of miniaturization and high density. The most commonly used are wing-shaped E-shaped and J-shaped, which are surface-mounted. Its pins are compatible with large-profile plastic SOPs. The copper lead frame has high conductivity, the pins have been electroplated, surface mount packages are used, and large chip pads can be selected.
6. Airtight SMD package
The airtight SMD package has the advantages of thinner, smaller and lighter leadless surface mount, good heat dissipation performance, and inherent low inductance and resistance. It is used in quartz devices, tooth filters, DPX and microelectronic mechanical systems. The application is more extensive, and the market share is good.
7. Ceramic Lids
The ceramic cover plate has various sizes, shapes and thicknesses, and is used in many types of packages, such as low-temperature sealed packages and high-temperature sealed packages, and can be composed of a single-layered ceramic or a multilayer structure, among which the multilayer structure The requirement is a cup-shaped cover plate. The most commonly used are ceramic flat packages. The ceramic cover plate can be used in high-temperature sealing and low-temperature sealing, and can be used for permanent marking. It has many characteristics of shape, size and thickness, and has two choices of solid and window.
8. Combo Lids
Some common ceramic shells:
1. Gold-tin cover dual-in-line package (SBDIP)
The gold tin cover package package is also called dual in-line package or DIP or DIL. The through-hole package consists of a sintered ceramic substrate, and two parallel rows of copper-plated pins are distributed on the edge of the substrate. Gold-tin cover dual-in-line packaging has large applications in semiconductor technology such as logic circuits, memory cards, microcontrollers and video controllers and consumer electronics, electronic commerce, military electronics, automobiles and communications, and has easy Installation, welding, separation, good heat dissipation performance, and the pins have been gold-plated in advance.
2. Ceramic Quad Flat Package (CQFP)
The ceramic four-sided lead flat package adopts a sealed surface mount package form. The ceramic and the lead frame are sealed together through glass to complete the connection between the internal chips and the external circuit board. The ceramic four-sided pin flat package is widely used in digital-to-analog converters, microwaves, logic circuit memory, microcontrollers and video controllers, etc. It has a variety of pin forms and pin coatings, and the pressure welding feet are coated with gold or aluminum. , The structure is mostly E-shaped or J-shaped, and the packaging materials are diverse.
3. Ceramic pin grid matrix package (CPGA)
The ceramic pin grid matrix package has the advantages of small size, excellent electrical characteristics, low electrical inductance, and good heat dissipation. Its through-hole package is composed of a sintered ceramic base with a gold-plated pin matrix on the bottom or top of the base. The sealing material of the package cover can be ceramic glass or metal welding. The ceramic pin grid matrix package has the characteristics of solid structure, various package sizes, multi-layer ceramic package, cavity facing upwards or cavity facing downwards.
4. TO Headers
The TO packaged case is mainly used in highly reliable microcircuit modules. The single-structure TO packaged case has high strength and can withstand high pressure. The TO packaged case can meet a variety of needs. TO metal shell has the characteristics of simplified circuit installation, convenient inspection and testing, high reliability, and various sizes and pin numbers.
5. Small outline integrated circuit packaging (SOIC)
The small-profile integrated circuit package has various specifications, which can meet some requirements of miniaturization and high density. The most commonly used are wing-shaped E-shaped and J-shaped, which are surface-mounted. Its pins are compatible with large-profile plastic SOPs. The copper lead frame has high conductivity, the pins have been electroplated, surface mount packages are used, and large chip pads can be selected.
6. Airtight SMD package
The airtight SMD package has the advantages of thinner, smaller and lighter leadless surface mount, good heat dissipation performance, and inherent low inductance and resistance. It is used in quartz devices, tooth filters, DPX and microelectronic mechanical systems. The application is more extensive, and the market share is good.
7. Ceramic Lids
The ceramic cover plate has various sizes, shapes and thicknesses, and is used in many types of packages, such as low-temperature sealed packages and high-temperature sealed packages, and can be composed of a single-layered ceramic or a multilayer structure, among which the multilayer structure The requirement is a cup-shaped cover plate. The most commonly used are ceramic flat packages. The ceramic cover plate can be used in high-temperature sealing and low-temperature sealing, and can be used for permanent marking. It has many characteristics of shape, size and thickness, and has two choices of solid and window.
8. Combo Lids
The composite cover plate is also called a welded sealing cover plate. The conventional cover plate is made of alloy 42 or Kehua material, plated with gold or nickel, and the Au-Sn eutectic frame is adhered to the cover plate. The process requirements of the composite cover plate are relatively strict, and have the char acteristics of high corrosion resistance, high moisture resistance, and relatively simple welding process.
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